CPU cooler Sapphire Vapor-X
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The main advantage of this system over conventional heatpipes with copper base or direct contact is that the heat distribution is much more homogeneous throughout the dissipation surface in contact with the CPU. Processors usually have hotter areas than others, which make the heat transfer to the heatsink fins not homogeneous, since some heatpipes will transmit more temperature than others, the vapor chambers distribute all the heat over the contact surface, which in turn transmits the heat to the heatpipes, reaching all the same temperature and dissipating more efficiently when reaching the radiator fins.
Specifically, Sapphire's proposal has a vapor chamber connected to four copper heatpipes with nickel coating that transmit heat through their internal liquid to the aluminum fins of the heatsink.
The Sapphire Vapor-X also features two 120 mm fans with speed regulation, with a maximum of 2,200 RPM, along with a black casing to give it a different touch. It will arrive in the coming weeks in stores for a price between 50 and 60 € approximately.
Cluster MPI de tres nodos formado por tres SERVIDORRES HP PROLIANT DL360P 1U 2X E5-2680V2 CPU'S, 20 cores, 40 hilos a una frecuencia base de 2,8GHz. 192 GB de memoria RAM DDR3 ECC (8 x módulos de16 GB 800Mhz)´+ 1U 2X E5.-2697 V2 a una frecuencia base de 2,8 Ghz 192 GB de Ram ECC (8 módulos de 16 Gb 800 mhz) 24 Cores 48 hilos ( 44c/88T)+ 1u 2xE5 2603v2 con una frecuencia base de 1,9ghz 64 Gb DDR3 ecc (4x módulos de 16)
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