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    New approach to introduce CPU and DRAM in the same package

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    • jordiquiJ Desconectado
      jordiqui Veteranos HL
      Última edición por

      Venray Technologies, a North American company based in Texas, has offered some details of what can be considered a new technological approach to exponentially improve the performance of computers and servers. It has been developing it for the last 7 years and it now seems to be ready to begin the manufacturing process, so it is looking for investors.

      Placing the memory in the same silicon package as the CPU will allow for an exponential improvement in bandwidth

      This is the TOMI (Thread Optimised Multiprocessor Technology) technology that, basically, aims to overcome the performance problems caused in the communication of data between the CPU and the main memory of the system, DRAM.

      This technology includes both components (in addition to cache memory) in the same silicon package, so their communication could exponentially improve overall performance.

      It is an approach that has been talked about for years, but even the big manufacturers do not seem to have yet come up with a viable solution. Even more so considering that, according to some experts, implementing a greater number of cores does not necessarily mean more power.

      The CEO of Venray himself, Russell Fish, warns that the multi-core technology of processors allows for performance improvement, but only in "small amounts". Beyond six or eight cores, performance does not increase at the same rate, especially when it comes to processing large amounts of data such as those handled in cloud computing applications.

      To overcome this obstacle, which is largely found in the available bandwidth between the main memory and the processor, Venray proposes to bring these elements as close as possible, at the package level. A clear example is the communication existing between the CPU and cache memory, where the speeds at which data is transmitted are radically superior.

      The fundamental problem, the high cost in the manufacture of chips where DRAM memory is embedded in the silicon chip. However, part of its price could be reduced by designing simpler processors, which also reduces the communication logic gates between the CPU and DRAM memory. That is exactly what Venray says it has achieved.


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      Cluster MPI de tres nodos formado por tres SERVIDORRES HP PROLIANT DL360P 1U 2X E5-2680V2 CPU'S, 20 cores, 40 hilos a una frecuencia base de 2,8GHz. 192 GB de memoria RAM DDR3 ECC (8 x módulos de16 GB 800Mhz)´+ 1U 2X E5.-2697 V2 a una frecuencia base de 2,8 Ghz 192 GB de Ram ECC (8 módulos de 16 Gb 800 mhz) 24 Cores 48 hilos ( 44c/88T)+ 1u 2xE5 2603v2 con una frecuencia base de 1,9ghz 64 Gb DDR3 ecc (4x módulos de 16)

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      • cobitoC Desconectado
        cobito Administrador
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        Between the inclusion of graphics cards in the same package and this, all that's left is to put in an ssd drive so that the entire PC is on a single chip.

        Toda la actualidad en la portada de Hardlimit
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        • NemoN Desconectado
          Nemo Veteranos HL @cobito
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          @cobito:

          Between the inclusion of graphics cards in the same package and this, all that's left is for them to put in an ssd drive so that the entire PC is on a single chip.

          Give them time... everything will take its course.;D

          Mis equipos

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