Ivy Bridge LGA1155 heatsinks
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more reason than a saint if so you save yourself licking the IHS ;D -
I think the calentorros are coming out, especially with decent OCs. A little more performance, a little less voltage and the improvement in graphics or the USB 3 that doesn't interest us... If it's not to put together a piece of SLI/Cross later these Ivy don't succeed and with Haswell around the corner in my opinion it's worth waiting, because the SB-E have not come out very good either, they degrade more than the Sandy. Unless they release a revision...
Without a doubt the release of the Sandy or shortly after was the time to buy. It's like the 5850 at 100 bucks, a year later we have the same thing more expensive.
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But what about the ones in the stores? The samples are definitely hot, a micro like that with paste on the IHS must be hot for sure.
If the one in the store is hot, then it will be enough to doubt a lot until someone finally exposes it.
more reason than a saint if you save yourself from lapping the IHS;D
Lapping is actually just a plan, but it doesn't matter how many millimeters you reduce the IHS, removing it completely is much better.
Lapping should be done if at all to the die (the micro's packaging under the IHS) if it proves not to be as flat as it appears.Salu2.
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but what about the ones in the stores?, the samples are probably hot, a micro like that with paste on the ihs must be hot for sure.
If the one in the store is hot, then it will be enough to doubt a lot until someone finally exposes it.
Lapping is actually just a plan, but it doesn't matter how many millimeters you reduce the IHS, removing it completely is much better.
Lapping should be done if at all to the die (the micro's packaging under the IHS) if it proves not to be as flat as it appears.Salu2.
that's what I meant if the IHS is glued …. it's removed and we have "direct contact"
about lapping the die :frio: I don't know, it must measure 10 by 20 mm -
The thing is that it will take time to check whether or not there is any mess made by some ordinary user, because I doubt that someone who gets a new Ivy will try their luck in trying to "uncork" it out of curiosity at the risk of ruining it <:(
Regards
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The thing is that it will take time to check if there is any mess on the part of a regular user or not, because I doubt that someone who gets a new Ivy will try to "uncork" it out of curiosity at the risk of ruining it <:(
Regards
aaayyyyy Sylver sylver what faith you have in the human race ;D
Remove IHS from i7, and not kill it + insane cooling. - Overclocking of CPUs - HardwareMX -
The thing is that it will take time to check if there is any mess on the part of any regular user, because I doubt that someone who gets a new Ivy will try to "uncork" it out of curiosity at the risk of ruining it <:(
Regards
Don't believe it, there are very heavy-duty white communities... with a little luck (and time).
PD:
aaayyyyy Sylver sylver what faith you have in the human race ;D
Remove IHS from i7, and don't kill it + insane cooling. - Overclocking of CPUs - HardwareMXYes yes, you better research and then tell me what is the risk proportion of ruining it (no matter how skilled you are).
The "uncapping" on IHS that come with paste is already delicate by itself, but having to melt solder under the IHS is hardcore of the good kind.
Uncapping IHS that is soldered requires, among other tools and means for its realization, to have a backup micro ready on the table before starting so you can go buy another one if necessary.If you don't, just type the term "uncapping" in Google images and you'll see even desoldered pills.
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I remember that I opened a P4 that had broken down and the truth is that it is difficult to remove it although that black silicone does not seem to stick. Personally I would not risk it for a few extra degrees.
What I had no idea about was that there were IHS soldiers… as far as I know they all have thermal paste inside, right?
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Apparently they use a solder that melts before the one that holds the chip itself.
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When the website that unscrewed the micro contacted intel; they replied that everything was normal and reminded them that the lower ranges have paste instead of being soldered.
Now, the explanations increase for why the new Ivy B.s must be somewhat hotter than the Sandy B.s, but surely having the TIM instead of "solders" also shouldn't help at all.
As defaultuser points out, it's also not 100% confirmed that the retail versions (for the public) are like the samples sent for reviews.
For those who take "unscrewing" micros as something normal, some things to keep in mind are:
1º - You lose the warranty
2º - You can fry it
3º - The socket stops holding the processor in place (see point 2)
4º - You must compensate for the lower height of the processor when placing the heatsink (see point 2)
5º - The contact surface is much more delicate (see point 2)
6º - Probably at the Casino you have better odds, but if you don't mind losing money maybe the LGA2011 platform is the most suitable for you, Mr. Botín ;DSalu2!
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Man the idea is to take it apart to put in a higher quality paste and seal it with silicone again… otherwise it would be crazy. But as you say Fassou on a low-end mic, going in for this nonsense doesn't make sense.
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Don't believe me, there are very heavy gringo communities... with a little luck (and time).
PD:
Yes, yes, you better document yourself and then tell me what the risk ratio is for screwing it up (no matter how much of a phenomenon you are).
The "uncapping" on IHS that come with paste is already delicate in itself, but having to melt solder under the IHS is hardcore of the good kind.
Uncapping IHS that is soldered requires, among other tools and means for its realization, to have a backup processor ready on the table before you start, in case you have to buy another micro if things go wrong.If you don't believe me, type the term "uncapping" into Google images and you'll see even desoldered pills.
note, I'm not saying it's easy or sensible, I'm just saying (I'll put the link) that people who don't have economic problems and who, if they screw it up, well that's it... in relation to Sylver's comment that no one will do that with a new micro
P.D. defaultuser will be no different..... because for uncapping I get this http://es.wikipedia.org/wiki/Uncapping
regards -
Well, yes, and what was the other one called?
Haaa well, look, it turns out it's not, after all, uncap is to uncover in the end.
Both things are uncapping, as soon as I saw the uncap of the modems I immediately thought I had mixed up words.PD:
Don't use the wiki as if it were the bible.
I'll give you an example: In the English version of the wiki it says: "…Uncapping, in the context of cable modems, refers to... "
that is "uncapping, in the context of cable modems refers to..." -
Well, it seems like it is, and what was the other one called?
Haaa, well, it turns out it's not after all, uncap is to uncover in the end.
Both things are uncapping, as soon as I saw the uncap of the modems I thought I had mixed up the words.well no ;D it seems like you're right
images uncapping - Search with Google
but there are few of IHS and most (if not all are of AMD "attached") -
Defaultuser, that's called "Unplugging the mic to record it" :troll::troll:
Sorry for the offtopic ;D
Best regards
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en cualquier caso creo yo que no estamos saliendo de el tema: Ivy Bridge LGA1155 calentorros ( con el IHS pegado , que no soldado ) y que si finalmente sale al mercado pegado posiblemente ara las delicias de de alguno que otro y si sale soldado alguno que otro lo des soldara solo para decir que se puede hacer , al igual que alguno que otro se comprara una GTX690 y le ara OC extremo solo para salir en un record . guste o no es así en este mundillo por suerte o desgracia tenemos de todo , para bien o para mal
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" …
pero se ven pocas de IHS y la mayoría ( por no decir todas son de AMD "pegados" )Pues este estava con soldadura je je:

Pon "his removal"
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este es maa heavy
Resultados de la Búsqueda de imágenes de Google de http://forums.extremeoverclocking.com/attachment.php%3Fattachmentid%3D102654%26stc%3D1%26d%3D1177529915P:D IHS no HIS que sino no te cuento lo que sale ;D
y este lo tengo que traducir con calma
http://www.overclock.net/gallery/data/500/CLP-IHS.jpg
Coolaboratory Liquid Pro Vs Artic Silver 5 Test results -
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eso del liquid, si te lees las instrucciones veras que es un engorro.
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por si alguno quiere ahorrase el engorro ( e usado el de google )
Coolaboratory Liquid Pro Vs Artic Silver 5 resultados de las pruebas¿Ha escuchado una mezcla del bien y del mal a través de mi búsqueda, pero en general parece que podría valer la pena un par de grados más de AS5, así que tuve que probar a mí mismo.
El hecho de que algunas personas no lo toque diciendo que es un PITA total de la instalación fue casi atractiva … ahh un nuevo reto ..
Este es el paquete que usted consigue, una siringe muy pequeño con una aguja hipodérmica. Cuidado que no quieres a ti mismo seguir con esto, o dejarlo fuera donde los niños pueden llegar.
Instalación:
Es un tiempo muy lento PITA, eso es seguro, pero también es muy importante creo que te tomas tu tiempo y frotar el material sobre las superficies lo suficientemente bien como para romper la tensión superficial y la unión de ganancia. Esperar una buena media hora sólo para instalar, y también esperamos que usted tendrá que quitar el procesador y el bloque de agua para aplicar correctamente con buena luz.Aquí es una perla en el IHS:
Difundir la cosas de un lado, mi forma de trabajo desde el centro:
IHS realizado e instalado:
Bloquear la cobertura:
Hasta el momento, estoy muy impresionado, la caída de 2,5 C en la caída de vacío y 3.4c de TAT temps carga del 100% es muy significativo para un simple cambio de TIM, a pesar de que no viene sin algunos puntos negativos. He oído a varias personas se quejan de que la materia tiene una tendencia a querer pegar a su bloque en el chip, o que es difícil de quitar la pasta de los chips o bloques. El folleto CLP viene con toma nota de que la extracción puede requerir un metal pulido para eliminar la pasta, y es muy explícito acerca de ALUMINIM NO! período de refrigeradores … se va a comer de aluminio. De todos modos, yo soy todo para el riesgo añadido y dificultades teniendo en cuenta el resultado, que es una mejora sustancial en mi humilde opinión.
A continuación se presentan las diferencias de temperatura de agua a la base. Tenga en cuenta que estas temperaturas fueron registrados utilizando la función de registro de TAT y las temperaturas reales de la base. Temperaturas Core en mi 680i son típicamente alrededor 5C superior a la temperatura placa base. Por ejemplo, a temperatura ambiente 20.3C que actualmente tengo mi temperatura es 31C MB, y mi temperatura corporal es de alrededor de 36 º C TAT. También usé la carga TAT 100% que es la herramienta de carga más extrema disponible y mucho más intenso que cualquier otro programa como FTT orthos pequeña, la carga del mundo real es normalmente la mitad de esa cantidad. Estoy trazando agua a temperatura corporal, ya que lleva a cabo la variable de rendimiento del radiador, así como cambios de temperatura ambiente. Mi aire a la temperatura del agua a la carga que es correcto a 4 ° C con carga TAT 100% si lo dejo cargar durante 10 minutos.
El agua de espera a la diferencia de temperatura del aire suele ser un poco menos de 3C. Esto es con mi ciclo de CPU en un solo MCR320, D5 variable, con Yate Loon D12SL12 fans en un 1/2 "de espuma de la cubierta del ventilador.Todo esto se realiza con sondas acuario bastante baratas digitales que no son nada especial. Trato de mejorar la precisión al tomar una gran cantidad de mediciones y creo que esto me da una buena "relación" comparación, pero las mediciones reales podrían estar fuera ligeramente debido a los equipos utilizados.
Basta ya de que, aquí están los resultados finales:
(Actualización de 9.23 después de 40 Horas Tiempo de curado)
Datos:
Cada número de caso de prueba se llevó a cabo por la tala temperaturas TAT principales durante 10 minutos, mientras que el registro manual de la temperatura del aire y el agua en mis sondas digitales. Lo que ves en la línea de prueba es la temperatura promedio registrada TAT (generalmente 100 o más resultados), y mi promedio de 10 por aire y temperatura del agua 10.Gráfico:
Además probar en mi 8800 (archivo no traslapadas IHS), pero me he dado cuenta de que no le gusta para unir tan bien con el recubrimiento de níquel, ya que se cobre puro, así que estoy pensando que vea el mayor beneficio con una IHS traslapadas en la que terminará con un sándwich de cobre / CLP / cobre.
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