Ivy Bridge LGA1155 heatsinks

[Fassou]

From the website Overclockers.com, they claim to have discovered the reason why the new Ivy Bridge (LGA1155/22nm) heat up more easily than their Sandy Bridge brothers (LGA1155/32nm).

While the Sandy B. have the IHS (Integrated Heat Spreader) "welded" or in more technical terms, the top plate welded ;D, the new Ivy B. have taken the famous slogan of GIOR as their own: "A little paste, that's enough" :facepalm:

Salu2!

[amd125]

Well, they are not cheap for messing around. :osvaisacagar:

[Sylver]

Are you telling me that this mess is true? Today? I can't quite believe it…
Between the sources with concrete blocks and the "solar roofs" stuck on top of the micros, we have some hardware productions worthy of Pepe Gotera and Otilio... :facepalm:

Regards

[Jesus_Panella]

Bad thing if those Ivy Bridge are coming out hot, apart from the fact that in terms of performance they are not much superior to the Sandy Bridge. They must have messed up something, but of course, since the competition AMD has not yet released CPUs that can give Intel a hard time in any range, that's how things are going.

Let's see if in the end it will remind people of the famous Pentium 4 Prescott that were much hotter than their predecessors Pentium 4 Nothwood.

[defaultuser]

Calm down, folks. No need to panic ;D

I've also seen that news about Ivys "pre-release" with such a mess, but I still haven't heard from retail micros (final product bought in a store, let's say) that confirm it will be like that with paste, or if the final ones come with the IHS soldered and the paste mess was only used in engineering samples.

And since Mr. Fassou doesn't make it clear if he's talking about the famous news or if he's saying it has already been confirmed in retail micros, it's better not to stir up a fuss yet.

In the absence of information on the matter, it has to be said that it is much more likely to be a mess in an engineering sample and that the final ones will come soldered (I say it is much more likely).

In the meantime, we'll have to wait for confirmation with micros bought in the store.

And if by some chance the Ivy ends up coming out with the IHS "to the paste" don't worry, many overclockers and many hard-modders will be very happy.

Salu2.

[Franziskaner]

more reason than a saint if so you save yourself licking the IHS ;D

[Obione]

I think the calentorros are coming out, especially with decent OCs. A little more performance, a little less voltage and the improvement in graphics or the USB 3 that doesn't interest us... If it's not to put together a piece of SLI/Cross later these Ivy don't succeed and with Haswell around the corner in my opinion it's worth waiting, because the SB-E have not come out very good either, they degrade more than the Sandy. Unless they release a revision...

Without a doubt the release of the Sandy or shortly after was the time to buy. It's like the 5850 at 100 bucks, a year later we have the same thing more expensive.

[defaultuser]

But what about the ones in the stores? The samples are definitely hot, a micro like that with paste on the IHS must be hot for sure.

If the one in the store is hot, then it will be enough to doubt a lot until someone finally exposes it.

@Franziskaner
@Franziskaner:

more reason than a saint if you save yourself from lapping the IHS;D

Lapping is actually just a plan, but it doesn't matter how many millimeters you reduce the IHS, removing it completely is much better.
Lapping should be done if at all to the die (the micro's packaging under the IHS) if it proves not to be as flat as it appears.

Salu2.

[Franziskaner]

@defaultuser:

but what about the ones in the stores?, the samples are probably hot, a micro like that with paste on the ihs must be hot for sure.

If the one in the store is hot, then it will be enough to doubt a lot until someone finally exposes it.

@Franziskaner

Lapping is actually just a plan, but it doesn't matter how many millimeters you reduce the IHS, removing it completely is much better.
Lapping should be done if at all to the die (the micro's packaging under the IHS) if it proves not to be as flat as it appears.

Salu2.

that's what I meant if the IHS is glued …. it's removed and we have "direct contact"
about lapping the die :frio: I don't know, it must measure 10 by 20 mm

[Sylver]

The thing is that it will take time to check whether or not there is any mess made by some ordinary user, because I doubt that someone who gets a new Ivy will try their luck in trying to "uncork" it out of curiosity at the risk of ruining it <:(

Regards

[Franziskaner]

@Sylver:

The thing is that it will take time to check if there is any mess on the part of a regular user or not, because I doubt that someone who gets a new Ivy will try to "uncork" it out of curiosity at the risk of ruining it <:(

Regards

aaayyyyy Sylver sylver what faith you have in the human race ;D
Remove IHS from i7, and not kill it + insane cooling. - Overclocking of CPUs - HardwareMX

[defaultuser]

@Sylver:

The thing is that it will take time to check if there is any mess on the part of any regular user, because I doubt that someone who gets a new Ivy will try to "uncork" it out of curiosity at the risk of ruining it <:(

Regards

Don't believe it, there are very heavy-duty white communities... with a little luck (and time).

PD:

@Franziskaner:

aaayyyyy Sylver sylver what faith you have in the human race ;D
Remove IHS from i7, and don't kill it + insane cooling. - Overclocking of CPUs - HardwareMX

Yes yes, you better research and then tell me what is the risk proportion of ruining it (no matter how skilled you are).

The "uncapping" on IHS that come with paste is already delicate by itself, but having to melt solder under the IHS is hardcore of the good kind.
Uncapping IHS that is soldered requires, among other tools and means for its realization, to have a backup micro ready on the table before starting so you can go buy another one if necessary.

If you don't, just type the term "uncapping" in Google images and you'll see even desoldered pills.

[Bm4n]

I remember that I opened a P4 that had broken down and the truth is that it is difficult to remove it although that black silicone does not seem to stick. Personally I would not risk it for a few extra degrees.

What I had no idea about was that there were IHS soldiers… as far as I know they all have thermal paste inside, right?

[defaultuser]

Apparently they use a solder that melts before the one that holds the chip itself.

[Fassou]

When the website that unscrewed the micro contacted intel; they replied that everything was normal and reminded them that the lower ranges have paste instead of being soldered.

Now, the explanations increase for why the new Ivy B.s must be somewhat hotter than the Sandy B.s, but surely having the TIM instead of "solders" also shouldn't help at all.

As defaultuser points out, it's also not 100% confirmed that the retail versions (for the public) are like the samples sent for reviews.

For those who take "unscrewing" micros as something normal, some things to keep in mind are:

1º - You lose the warranty
2º - You can fry it
3º - The socket stops holding the processor in place (see point 2)
4º - You must compensate for the lower height of the processor when placing the heatsink (see point 2)
5º - The contact surface is much more delicate (see point 2)
6º - Probably at the Casino you have better odds, but if you don't mind losing money maybe the LGA2011 platform is the most suitable for you, Mr. Botín ;D

Salu2!

[Bm4n]

Man the idea is to take it apart to put in a higher quality paste and seal it with silicone again… otherwise it would be crazy. But as you say Fassou on a low-end mic, going in for this nonsense doesn't make sense.

[Franziskaner]

@defaultuser:

Don't believe me, there are very heavy gringo communities... with a little luck (and time).

PD:

Yes, yes, you better document yourself and then tell me what the risk ratio is for screwing it up (no matter how much of a phenomenon you are).

The "uncapping" on IHS that come with paste is already delicate in itself, but having to melt solder under the IHS is hardcore of the good kind.
Uncapping IHS that is soldered requires, among other tools and means for its realization, to have a backup processor ready on the table before you start, in case you have to buy another micro if things go wrong.

If you don't believe me, type the term "uncapping" into Google images and you'll see even desoldered pills.

note, I'm not saying it's easy or sensible, I'm just saying (I'll put the link) that people who don't have economic problems and who, if they screw it up, well that's it... in relation to Sylver's comment that no one will do that with a new micro

P.D. defaultuser will be no different..... because for uncapping I get this http://es.wikipedia.org/wiki/Uncapping
regards

[defaultuser]

Well, yes, and what was the other one called?

Haaa well, look, it turns out it's not, after all, uncap is to uncover in the end.
Both things are uncapping, as soon as I saw the uncap of the modems I immediately thought I had mixed up words.

PD:
Don't use the wiki as if it were the bible.
I'll give you an example: In the English version of the wiki it says: "…Uncapping, in the context of cable modems, refers to... "
that is "uncapping, in the context of cable modems refers to..."

[Franziskaner]

@defaultuser:

Well, it seems like it is, and what was the other one called?

Haaa, well, it turns out it's not after all, uncap is to uncover in the end.
Both things are uncapping, as soon as I saw the uncap of the modems I thought I had mixed up the words.

well no ;D it seems like you're right
images uncapping - Search with Google
but there are few of IHS and most (if not all are of AMD "attached")

[Nemo]

Defaultuser, that's called "Unplugging the mic to record it" :troll::troll:

Sorry for the offtopic ;D

Best regards